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Single Event Mechanisms in 90 nm Triple-well CMOS Devices

dc.creatorRoy, Tania
dc.date.accessioned2020-08-22T20:34:52Z
dc.date.available2010-07-28
dc.date.issued2008-07-28
dc.identifier.urihttps://etd.library.vanderbilt.edu/etd-07252008-100559
dc.identifier.urihttp://hdl.handle.net/1803/13567
dc.description.abstractTriple-well NMOSFETs collect more charge as compared to dual-well NMOSFETs. Single event charge collection mechanisms in 90 nm triple-well NMOS devices are explained and compared with those of dual-well devices. The primary factors affecting the single event pulse width in triple-well NMOSFETs are the separation of deposited charge due to the n-well, potential rise in the p-well followed by the injection of electrons into the p-well by the source, and removal of holes by the p-well contact. Design parameters of p-wells, such as contact area, doping depth and placement, are varied to reduce single event pulse widths. Pulse width decreases as the area of the p-well contacts increases, the p-well contacts becomes deeper, and the p-well contacts are placed more frequently. Increasing the p-well – n-well junction depth also causes the full width half rail (FWHR) pulse width to decrease. In long p-wells with multiple transistors present in them, a potential gradient occurs along the body of the well as regions of the well away from the strike remain unaffected.
dc.format.mimetypeapplication/pdf
dc.subjectCMOS
dc.subjecttriple well
dc.subjectsingle event
dc.subjectNMOSFET
dc.subjectpotential
dc.subjectsemiconductor physics
dc.titleSingle Event Mechanisms in 90 nm Triple-well CMOS Devices
dc.typethesis
dc.type.materialtext
thesis.degree.nameMS
thesis.degree.levelthesis
thesis.degree.disciplineElectrical Engineering
thesis.degree.grantorVanderbilt University
local.embargo.terms2010-07-28
local.embargo.lift2010-07-28
dc.contributor.committeeChairArthur F. Witulski
dc.contributor.committeeChairRonald D. Schrimpf


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