Depth-Dependent Single-Event Effect Analysis of a 3D-Integrated Imaging Chip

Abstract

Three-dimensional integrated circuits (3D-ICs) are increasingly common, allowing for more powerful devices with smaller footprints. However, intimately integrated functional layers can prove challenging to analyze for radiation response, as single ionizing events may affect multiple interdependent layers simultaneously. This work presents a generalizable data analysis technique that can be used to create a mapping of a 3D-IC imager’s single event response to the corresponding depth of sensitive volume. A case study using the technique to analyze single event effects in 3D-IC imager is then presented. The imager’s transient response is discernably changed with Bragg peak depth of incoming particles.